US Patent Issued to Hyundai Motor, Kia Corporation; Seoul on Sept. 15 for "Power module cooling device" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,740,010, issued on Sept. 15, was assigned to Hyundai Motor Co. (Seoul, South Korea) and Kia Corporation; Seoul (Seoul, South Korea).

"Power module cooling device" was invented by Sang Hun Lee (Whasung-Si, South Korea), Hyong Joon Park (Whasung-Si, South Korea) and Se Heun Kwon (Whasung-Si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A power module cooling device includes a manifold cover and a fin plate contained in the manifold cover, wherein a cooling fluid is ejected perpendicularly to heating surfaces through cooling fins of the fin plate configured perpendicularly to the longitudinal direction of the manifold cover so that a vertica...