US Patent Issued to HYPERLUME on Aug. 4 for "Method of packaging and integration for multi-layer system" (Canadian Inventor)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,843, issued on Aug. 4, was assigned to HYPERLUME INC. (Ottawa).

"Method of packaging and integration for multi-layer system" was invented by Mohsen Asad (Ottawa).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of packaging micro-LEDs onto a substrate including: microfabricating micro-LEDs on a transparent microdevice substrate with an epitaxial layer, aligning a test substrate with test electrodes to connect to the micro-LEDs, and injecting a current to capture brightness information and map healthy and defective micro-LEDs. The test substrate is removed, and a photo-sensitive polymer is coated on the microdevice substrate and optically patter...