US Patent Issued to Huawei Technologies on Oct. 6 for "Transistor-outline package and preparation method thereof, optical sub-assembly, optical module, and optical network system" (Chinese Inventors)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,754,382, issued on Oct. 6, was assigned to Huawei Technologies Co. Ltd. (Shenzhen, China).

"Transistor-outline package and preparation method thereof, optical sub-assembly, optical module, and optical network system" was invented by Yujie Zeng (Wuhan, China), Fei Gao (Wuhan, China) and Tao Liu (Wuhan, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments include transistor-outline packages, methods, optical sub-assemblies, and optical modules associated therewith. In some embodiments a transistor-outline package includes a transistor base, a transistor cap, a first lens, a light filtering assembly, a lens assembly, a first optical receiving ch...