US Patent Issued to Huawei Technologies on June 23 for "Heat dissipation apparatus and electronic device" (Chinese Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,573, issued on June 23, was assigned to Huawei Technologies Co. Ltd. (Shenzhen, China).

"Heat dissipation apparatus and electronic device" was invented by Lirui Jia (Dongguan, China), Chaorong Liu (Dongguan, China), Peng Jin (Dongguan, China) and Tao Yan (Dongguan, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A heat dissipation apparatus is provided. The apparatus includes: a bracket assembly including an accommodation portion used for accommodating a heat source component, a first opening, and a second opening; a heat sink. A heat conducting protrusion is disposed on a first surface of the heat sink, and the heat conducting protrusion exten...