US Patent Issued to Huawei Technologies on July 14 for "Electro-optic modulator, optical chip, and integrated chip" (Chinese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,681,340, issued on July 14, was assigned to Huawei Technologies Co. Ltd. (Shenzhen, China).

"Electro-optic modulator, optical chip, and integrated chip" was invented by Hongmin Chen (Shenzhen, China), Mengdie Sun (Wuhan, China), Xin Chen (Wuhan, China), Fusheng Tang (Shenzhen, China), Haifeng Shao (Wuhan, China), Lei Zhao (Wuhan, China) and Lei Liu (Chengdu, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electro-optic modulator is disposed on a surface of a substrate including: an optical waveguide layer disposed on the substrate, a modulation electrode disposed on the optical waveguide layer, and a metal electrode disposed on the modulation el...