US Patent Issued to Huawei Technologies on Feb. 10 for "Package chip having a heat sink and method for manufacturing package chip" (Chinese Inventors)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,726, issued on Feb. 10, was assigned to Huawei Technologies Co. Ltd. (Shenzhen, China).

"Package chip having a heat sink and method for manufacturing package chip" was invented by Jiantao Zheng (Shenzhen, China), Nan Zhao (Shenzhen, China), Shanghsuan Chiang (Shenzhen, China), Xiao Hu (Shenzhen, China), Junlei Tao (Shenzhen, China), Yu Jiang (Beijing) and Jianbiao Lu (Shenzhen, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A packaged chip and a method for manufacturing the packaged chip are provided. The packaged chip includes a substrate, a chip, and a heat sink. The heat sink includes a first bracket, a second bracket, and a cover. The firs...