US Patent Issued to Huawei Technologies'Co., 'Ltd.' on Nov. 3 for "Chip structure and chip preparation method" (Chinese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,867, issued on Nov. 3, was assigned to Huawei Technologies'Co.'Ltd.' (Shenzhen, China).

"Chip structure and chip preparation method" was invented by Heng Li (Shanghai), Xiaodong Zhang (Shenzhen, China), Tonglong Zhang (Shenzhen, China) and Simin Wang (Shanghai).

According to the abstract* released by the U.S. Patent & Trademark Office: "This disclosure provides a chip structure, including a first chip and a first protective layer, where the first protective layer covers a first surface of the first chip; and a first conductive connector is vertically disposed in the first protective layer, the first conductive connector penetrates through an upper surface and a lower surface of th...