US Patent Issued to Huawei Technologies'Co., 'Ltd.' on Nov. 18 for "MEMS chip, manufacturing method thereof, MEMS device, and electronic device" (Chinese Inventors)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,473,196, issued on Nov. 18, was assigned to Huawei Technologies'Co.'Ltd.' (Shenzhen, China).

"MEMS chip, manufacturing method thereof, MEMS device, and electronic device" was invented by Fengpei Sun (Shenzhen, China), Zhihong Feng (Wuhan, China), Jinghui Xu (Shenzhen, China) and Xiaoshi Dong (Shenzhen, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "An MEMS chip includes a substrate, a movable assembly, a fastening assembly, and a drive assembly. The fastening assembly is located between the substrate and the movable assembly. The movable assembly includes a fastening portion, a movable portion, and a first support beam. The first support beam is c...