US Patent Issued to Huawei Technologies'Co., 'Ltd.' on May 19 for "Printed circuit board and preparation method thereof, and electronic communication device" (Chinese Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,068, issued on May 19, was assigned to Huawei Technologies'Co.'Ltd.' (Shenzhen, China).

"Printed circuit board and preparation method thereof, and electronic communication device" was invented by Feng Gao (Dongguan, China), Shichao Tao (Dongguan, China) and Mingli Huang (Dongguan, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A printed circuit board, which may be included an electronic communication device, includes a substrate, a bonding layer, a copper foil, and a filler. The substrate is provided with a cavity, and the cavity penetrates through the substrate. Two surfaces of the substrate are covered with the copper foil. The copper foil is...