ALEXANDRIA, Va., March 31 -- United States Patent no. 12,593,644, issued on March 31, was assigned to Huawei Technologies'Co.'Ltd.' (Shenzhen, China).
"Chip packaging apparatus and terminal device" was invented by Chao Ma (Shenzhen, China), Yan Li (Shenzhen, China), Wenkai Fan (Shenzhen, China) and Shujie Cai (Shenzhen, China).
According to the abstract* released by the U.S. Patent & Trademark Office: "A chip packaging apparatus includes a first differential pin pair, a first pin, and a second pin. The first differential pin pair includes a first differential signal pin and a second differential signal pin. In addition, the first pin and the second pin are both located between the first differential signal pin and the second differential ...