US Patent Issued to Huawei Technologies'Co., 'Ltd.' on March 17 for "Packaging module, electronic device, and methods for manufacturing the same" (Chinese Inventors)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,581,599, issued on March 17, was assigned to Huawei Technologies'Co.'Ltd.' (Shenzhen, China).

"Packaging module, electronic device, and methods for manufacturing the same" was invented by Yatao Lv (Dongguan, China), Qingguo Tang (Dongguan, China) and Ning Wang (Dongguan, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments of this application disclose a packaging module and an electronic device. Both a first surface and a second surface of a PCB in the packaging module are covered with a molding layer, a conductive pin is electrically connected to the PCB, the conductive pin is packaged inside the molding layer along a stacking direction of...