US Patent Issued to Huawei Technologies'Co., 'Ltd.' on June 16 for "Heat dissipation apparatus, circuit module, electronic device, and circuit module assembly method" (Chinese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,076, issued on June 16, was assigned to Huawei Technologies'Co.'Ltd.' (Shenzhen, China).

"Heat dissipation apparatus, circuit module, electronic device, and circuit module assembly method" was invented by Wei Chen (Dongguan, China), Weice Ma (Shanghai), Benwei Lin (Shenzhen, China) and Xiaoyuan Ying (Shanghai).

According to the abstract* released by the U.S. Patent & Trademark Office: "In a dissipation apparatus, a support is mounted to a circuit board, and an assembly opening on a bearing portion in the support is configured to accommodate a heat source on the circuit board. A heat sink is disposed on the bearing portion of the support, and a heat conducting surface of the heat ...