US Patent Issued to Huawei Technologies'Co., 'Ltd.' on July 14 for "Substrate, packaged structure, and electronic device" (Chinese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,195, issued on July 14, was assigned to Huawei Technologies'Co.'Ltd.' (Shenzhen, China).

"Substrate, packaged structure, and electronic device" was invented by Huibin Chen (Shanghai), Yongzhao Lin (Dongguan, China) and Zhen Lv (Shanghai).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate, a packaged structure, and an electronic device are provided. The substrate is configured to be electrically connected to a chip. The chip includes a power terminal and a signal terminal. The substrate includes a first substrate and a second substrate mounted on the first substrate. The first substrate includes a first layout, and the first layout is configur...