US Patent Issued to Huawei Technologies'Co., 'Ltd.' on Jan. 20 for "Packaging module including electromagnetic shielding structure having conductive pillars and conductive adhesive, and packaging method therefor" (Chinese Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,744, issued on Jan. 20, was assigned to Huawei Technologies'Co.'Ltd.' (Shenzhen, China).

"Packaging module including electromagnetic shielding structure having conductive pillars and conductive adhesive, and packaging method therefor" was invented by Zhongli Ji (Shenzhen, China), Xulei Liu (Dongguan, China), Fengtian Hu (Shenzhen, China) and Hongwu Zhang (Dongguan, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "The technology of this application relates to a packaging module and a packaging method therefor, and an electronic device. The packaging module includes at least two device groups and a shielding structure configured to shield the at l...