US Patent Issued to Huawei Technologies'Co., 'Ltd.' on Feb. 24 for "Heat dissipation cabinet and communications device" (Chinese Inventors)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,563,699, issued on Feb. 24, was assigned to Huawei Technologies'Co.'Ltd.' (Shenzhen, China).

"Heat dissipation cabinet and communications device" was invented by Zhiwen Yang (Dongguan, China), Tao Yan (Dongguan, China), Jie Chen (Dongguan, China), Henglong Zou (Shenzhen, China) and Qingying Liu (Shenzhen, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A heat dissipation cabinet includes a cabinet body and a heat dissipation apparatus. A first accommodation region of the cabinet body can accommodate a plugboard in a stacked manner, and heat source components of the plugboard dissipate heat through the heat dissipation apparatus. An evaporator, a co...