US Patent Issued to Huawei Technologies'Co., 'Ltd.' on Feb. 10 for "Optical device assembly and method of manufacturing same" (Canadian Inventor)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,546,945, issued on Feb. 10, was assigned to Huawei Technologies'Co.'Ltd.' (Shenzhen, China).

"Optical device assembly and method of manufacturing same" was invented by Anver Malam (Kanata, Canada).

According to the abstract* released by the U.S. Patent & Trademark Office: "An optical device (OD), a semiconductor wafer structure (SWS) and a method of making the same are provided. The OD has a first semiconductor member (FSM), a second semiconductor member (SSM) and an OD mount. The OD mount has an optical component whose function is to receive an optical beam (OB) from a source and provide the OB to a destination. A portion of the OD mount is held in a cavity defined by the FSM and th...