ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,501,579, issued on Dec. 16, was assigned to Huawei Technologies'Co.'Ltd.' (Shenzhen, China).
"Heat dissipation apparatus and processor" was invented by Hui Jia (Dongguan, China), Jiyang Li (Dongguan, China) and Chao Wang (Yokohama, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A heat dissipation apparatus is provided. The heat dissipation apparatus includes an immersion tank. The immersion tank accommodates a liquid medium. When being used, the board is immersed in the liquid medium, and the liquid medium dissipates heat for the board by absorbing heat. The heat dissipation apparatus further includes a condenser immersed in the liquid medium. The...