ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,501,200, issued on Dec. 16, was assigned to Huawei Technologies'Co.'Ltd.' (Shenzhen, China).
"Headset, headset assembly, and related method" was invented by Chengjie Shen (Shanghai), Dexin Xu (Shenzhen, China), Yinhu Zhu (Shanghai) and Xun Zhang (Shenzhen, China).
According to the abstract* released by the U.S. Patent & Trademark Office: "This application discloses a headset, where the headset includes an ear housing and an earbud fastened to the ear housing, the earbud includes an earbud body and an SMA component embedded in the earbud body, and the earbud can automatically adjust a shape to adapt to a wearing environment. This application further discloses another headset, where th...