ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,500,136, issued on Dec. 16, was assigned to Huawei Technologies'Co.'Ltd.' (Shenzhen, China).
"Chip module and electronic device" was invented by Feng Wang (Shenzhen, China), Youhu Zhao (Dongguan, China), Yalei Zhang (Dongguan, China) and Yangyun Xie (Dongguan, China).
According to the abstract* released by the U.S. Patent & Trademark Office: "A chip module includes a circuit board, a slot disposed on a surface of one side of the circuit board, a lidless packaged chip, a heat radiator, and a substrate fixing assembly. The lidless packaged chip includes a substrate and a die packaged on the substrate. The slot is electrically connected to the circuit board, the lidless packaged chip ha...