ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,250, issued on Feb. 10, was assigned to HUAWEI DIGITAL POWER TECHNOLOGIES Co. LTD. (Shenzhen, China).
"Package structure and electronic device" was invented by Xiaojing Liao (Shenzhen, China).
According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure includes a protection structure, a circuit board, and a chip. The circuit board includes a first cabling layer, a dielectric layer, and a second cabling layer that are laminated. The protection structure is disposed inside the dielectric layer. The protection structure is configured to electrically connect the first cabling layer to the second cabling layer, and the chip is electrically connected...