US Patent Issued to HUAQIAO UNIVERSITY on June 2 for "Integrated machining device for grinding and polishing diamond and method thereof" (Chinese Inventors)

ALEXANDRIA, Va., June 2 -- United States Patent no. 12,643,191, issued on June 2, was assigned to HUAQIAO UNIVERSITY (Quangzhou City, China).

"Integrated machining device for grinding and polishing diamond and method thereof" was invented by Jing Lu (Xiamen City, China), Hailang Wen (Xiamen City, China), Qiufa Luo (Xiamen City, China), Chen Li (Xiamen City, China) and Tengfeng Ai (Xiamen City, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated device for grinding and polishing a diamond and a method thereof are provided. The integrated device for grinding and polishing the diamond comprises a base device and a grinding and polishing device, the base device comprises a base configured rotate a...