US Patent Issued to HUADA SEMICONDUCTOR on Aug. 25 for "Micro-application processor architecture" (American, Chinese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,717,399, issued on Aug. 25, was assigned to HUADA SEMICONDUCTOR Co. LTD. (Shanghai).

"Micro-application processor architecture" was invented by Xucheng Wang (San Diego), Wei Xie (Shanghai), Bin Liu (Shanghai), Jingwei Xu (Plano, Texas), Kai Qiao (Shanghai), Wei Xu (Shanghai), Jian He (Shanghai), Dawei Li (Shanghai), Yuxiao Gong (Shanghai), Kebin Li (Shanghai) and Wei Wu (Shanghai).

According to the abstract* released by the U.S. Patent & Trademark Office: "A MAP architecture includes a low-voltage digital module, a low-voltage analog module, and one or more high-voltage analog modules. The low-voltage digital module is communicatively connected to the digital signal bus for implement...