ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,757, issued on Jan. 27, was assigned to HRL LABORATORIES LLC (Malibu, Calif.).
"Bond tool with micro vacuum grooves" was invented by Partia Naghibi Mahmoudabadi (Malibu, Calif.) and Chiaming Chang (Malibu, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A bond tool for bonding ultra-thin substrates includes: a mesh pattern comprising a plurality of micro grooves having a depth in a range of 1 to 10 um; a plurality of front-side vias in a center portion of the mesh pattern and having a depth in a range of 100 to 200 um; and a back-side via connected to the plurality of front-side vias. A method of manufacturing a bond tool for bonding ultra-thi...