US Patent Issued to HPSP on Aug. 4 for "High pressure heat treatment apparatus" (South Korean Inventor)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,698,939, issued on Aug. 4, was assigned to HPSP Co. Ltd. (Gyeonggi-do, South Korea).

"High pressure heat treatment apparatus" was invented by Kun Young Lim (Gyeonggi-do, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a high pressure heat treatment apparatus including: an internal chamber accommodating an object to be heat-treated; an external chamber including a housing and a partition plate partitioning the housing into a high-temperature zone accommodating the internal chamber and a low-temperature zone having a lower temperature than the high-temperature zone, the partition plate including a discharge hole for allowing the high...