US Patent Issued to Howmedica Osteonics on Oct. 27 for "Systems and methods for preparing bone voids to receive a prosthesis" (New Jersey, Connecticut Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,773,222, issued on Oct. 27, was assigned to Howmedica Osteonics Corp. (Mahwah, N.J.).

"Systems and methods for preparing bone voids to receive a prosthesis" was invented by Damon J. Servidio (Towaco, N.J.), Carlos E. Collazo (Old Greenwich, Conn.) and Sujit Sivadas (Bridgewater, N.J.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of implanting a knee prosthesis includes forming a bone void at an end of a bone, implanting a void filler in the bone void, and implanting a knee prosthesis onto the end of the bone so that a stem of the knee prosthesis is received by the void filler."

The patent was filed on Jan. 15, 2025, under Application No. 19/0...