US Patent Issued to Hosiden on Feb. 3 for "Sensor module" (Japanese Inventors)

ALEXANDRIA, Va., Feb. 3 -- United States Patent no. D1,110,875, issued on Feb. 3, was assigned to Hosiden Corp. (Osaka, Japan).

"Sensor module" was invented by Shinu Chin (Osaka, Japan), Eiji Sato (Osaka, Japan), Ryo Inoue (Osaka, Japan), Toshikazu Iwaki (Osaka, Japan) and Hayato Kondo (Osaka, Japan).

The patent was filed on July 13, 2023, under Application No. D/897,272.

*For further information, including images, charts and tables, please visit: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=1&f=G&l=50&co1=AND&d=PTXT&s1=D1110875&OS=D1110875&RS=D1110875

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