US Patent Issued to HORIBA on May 19 for "Element analysis device, mounting jig, and mounting method" (Japanese Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,631,533, issued on May 19, was assigned to HORIBA LTD. (Kyoto, Japan).

"Element analysis device, mounting jig, and mounting method" was invented by Takahito Inoue (Kyoto, Japan), Hiroshi Uchihara (Kyoto, Japan) and Yasushi Hirata (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "In order to provide an elemental analysis device that includes an electrode having a housing recess where a crucible is housed during an elemental analysis, and that is capable of making only the part of a consumed electrode tip replaceable, an elemental analysis device including a first electrode and a second electrode between which a crucible MP containing a sample i...