US Patent Issued to Honor Device on Sept. 15 for "Connection structure and electronic device" (Chinese Inventors)

ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,737,007, issued on Sept. 15, was assigned to Honor Device Co. Ltd. (Shenzhen, China).

"Connection structure and electronic device" was invented by Yin Meng (Shenzhen, China), Yang Fan (Shenzhen, China), Weiwei Xie (Shenzhen, China), Lingyu Bi (Shenzhen, China) and Xuyang Wang (Shenzhen, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments of this application provide a connection structure and an electronic device. The electronic device includes at least a middle frame, a metal structural member, and a fastener; the metal structural member has a first through hole, the middle frame has a second through hole, and the fastener passes through t...