US Patent Issued to HONOR DEVICE on May 13 for "Signal transmission structure, electronic device, and PCB" (Chinese Inventor)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,302,490, issued on May 13, was assigned to HONOR DEVICE Co. LTD. (Shenzhen, China).

"Signal transmission structure, electronic device, and PCB" was invented by Puwei Bai (Shenzhen, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A signal transmission structure, an electronic device, and a PCB. The signal transmission structure includes a reference ground layer and a signal layer disposed above the reference ground layer. The signal layer includes a plurality of signal transmission lines are disposed in parallel along a line width direction having gaps therebetween. The reference ground layer includes a first reference area, and the first reference ...