US Patent Issued to Honor Device on March 31 for "Middle frame assembly, preparation method thereof, and electronic device" (Chinese Inventors)

ALEXANDRIA, Va., March 31 -- United States Patent no. 12,592,988, issued on March 31, was assigned to Honor Device Co. Ltd. (Shenzhen, China).

"Middle frame assembly, preparation method thereof, and electronic device" was invented by Yin Meng (Shenzhen, China), Jing Gao (Shenzhen, China) and Cheng Jiang (Shenzhen, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed is a middle frame assembly, including a middle plate and a frame disposed around an outer edge of the middle plate, where the middle plate includes a first carbon fiber reinforced resin composite material base body and a first metal plating layer compounded on a surface of the base body. Some embodiments of this application further prov...