US Patent Issued to Honor Device on Aug. 26 for "Sound pickup method for terminal device through Bluetooth peripheral and terminal device" (Chinese Inventors)

ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,401,740, issued on Aug. 26, was assigned to Honor Device Co. Ltd. (Shenzhen, China).

"Sound pickup method for terminal device through Bluetooth peripheral and terminal device" was invented by Nengfu Tang (Shenzhen, China), Yongmin Niu (Shenzhen, China), Shuaiqi Wang (Shenzhen, China) and Pengfei Huang (Shenzhen, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "This application provides a sound pickup method for a terminal device through a Bluetooth peripheral and a terminal device. The terminal device may pick up sound data through a microphone of the Bluetooth peripheral, and may perform targeted sound effect processing on the sound data picked up ...