US Patent Issued to Hong Kong HaiCun Technology on May 12 for "Discrete three-dimensional processor" (Oregon Inventor)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,626,114, issued on May 12, was assigned to Hong Kong HaiCun Technology Co. Ltd. (Kowloon, Hong Kong).

"Discrete three-dimensional processor" was invented by Guobiao Zhang (Corvallis, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A discrete three-dimensional (3-D) processor comprises a plurality of storage-processing units (SPU's), each of the SPU's comprising a non-memory circuit, at least a memory array and at least an off-die peripheral-circuit component thereof. The 3-D processor further comprises first and second dice. The first die comprises the memory arrays, whereas the second die comprises the non-memory circuit and the off-die peripheral-c...