US Patent Issued to Hong Kong Applied Science and Technology Research Institute on Sept. 1 for "System and method for defect classification and localization with self-supervised pretraining" (Chinese Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,725,047, issued on Sept. 1, was assigned to Hong Kong Applied Science and Technology Research Institute Co. Ltd. (Hong Kong, Hong Kong).

"System and method for defect classification and localization with self-supervised pretraining" was invented by Hon Chung Lee (Hong Kong, Hong Kong) and Jiayu Shu (Hong Kong, Hong Kong).

According to the abstract* released by the U.S. Patent & Trademark Office: "A system and a method for classifying and localizing surface defects with a high accuracy rate when only a small number of labeled defect data is available. The method comprises predicting a defect class for an input image using a convolutional neural network (CNN) classification model; and ...