US Patent Issued to Hong Kong Applied Science and Technology Research Institute on June 16 for "Ultrasonic-echo envelope detection with shared finite-impulse-response (FIR)/Hilbert multiplier" (Chinese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,656,469, issued on June 16, was assigned to Hong Kong Applied Science and Technology Research Institute Co. Ltd. (Hong Kong, Hong Kong).

"Ultrasonic-echo envelope detection with shared finite-impulse-response (FIR)/Hilbert multiplier" was invented by Eric Kwong Hang Tsang (Hong Kong, Hong Kong), Nok In Loi (Hong Kong, Hong Kong) and Jingwei Xie (Hong Kong, Hong Kong).

According to the abstract* released by the U.S. Patent & Trademark Office: "An ultrasonic echo envelope detector has an analytic transformer receiving a digitized ultrasonic echo waveform that performs a band pass Finite-Impulse-Response (FIR) filter and a Hilbert transform to generate inline and quadrature outputs for ...