US Patent Issued to Honeywell International on May 12 for "Systems and methods for assessing a condition of a package in a facility" (Indian Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,626,218, issued on May 12, was assigned to Honeywell International Inc. (Charlotte, N.C.).

"Systems and methods for assessing a condition of a package in a facility" was invented by Karthik Gundlapalli (Hyderabad, India), Sunil Mishra (Hyderabad, India) and Ashwini Kumar Vangala (Hyderabad, India).

According to the abstract* released by the U.S. Patent & Trademark Office: "Various embodiments described herein relate to systems and methods for assessing a condition of a package in a facility. In this regard, first data from one or more first sensors is received once a worker picks the package at a first location in the facility. Further, based on the first data it is determined if the ...