US Patent Issued to Honda Motor on June 2 for "Garnish assembly and method" (Ohio Inventors)

ALEXANDRIA, Va., June 2 -- United States Patent no. 12,643,490, issued on June 2, was assigned to Honda Motor Co. Ltd. (Tokyo).

"Garnish assembly and method" was invented by Christopher Wayne Emerson (Dublin, Ohio), David J. Rose (West Mansfield, Ohio), Jesse W. Schlabach (Marysville, Ohio), Hirofumi Takemoto (Dublin, Ohio), Jason S. Borland (Raymond, Ohio) and Timothy J. Rupp (Dublin, Ohio).

According to the abstract* released by the U.S. Patent & Trademark Office: "A garnish assembly and method for a vehicle includes a garnish housing having a show surface delineated by an end edge surface for mounting on the vehicle. The garnish assembly further includes a seal extending along an entirety of the end edge surface and a doghouse structur...