US Patent Issued to Honda Motor on July 14 for "Bonding device and bonding method for friction stir bonding and resistance welding" (Japanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,678,885, issued on July 14, was assigned to Honda Motor Co. Ltd. (Tokyo).

"Bonding device and bonding method for friction stir bonding and resistance welding" was invented by Akiyoshi Miyawaki (Saitama, Japan), Mitsuru Sayama (Saitama, Japan) and Taichi Kurihara (Saitama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A bonding device for joining together a first member (3), an intermediate member (4), and a second member (3) which are layered as a laminated assembly includes a probe (12, 41, 52), an anvil (11), a drive mechanism (14) configured to rotate the probe around the central axial line and move the probe toward and away from the second me...