ALEXANDRIA, Va., March 3 -- United States Patent no. 12,565,010, issued on March 3, was assigned to HL Klemove Corp. (Incheon, South Korea).
"Different material bonding apparatus and operation method thereof" was invented by Minha Lee (Anyang-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed herein are a different material bonding apparatus and an operation method thereof. The different material bonding apparatus in accordance with the present embodiment includes a first layer and a second layer formed of materials having different melting points and each having one surface contacting one surface of the other and a heater configured to apply heat to the other surface of the second laye...