US Patent Issued to HITACHI on Nov. 18 for "Superconducting wire, method for manufacturing superconducting wire, and MRI device" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,476,024, issued on Nov. 18, was assigned to HITACHI LTD. (Tokyo).

"Superconducting wire, method for manufacturing superconducting wire, and MRI device" was invented by Hideki Tanaka (Tokyo), Takaaki Suzuki (Tokyo) and Motomune Kodama (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A superconducting wire comprises a MgB2 filament, a base material, a high-thermal expansion metal, and a stabilizing material. The high-thermal expansion metal is a metal (for example, stainless steel) having a higher thermal expansion coefficient at room temperature than the MgB2 and the base material (for example, iron or niobium). The manufacturing method includes a s...