US Patent Issued to Hitachi on April 7 for "Injection molding condition generation system and method" (Japanese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,594,706, issued on April 7, was assigned to Hitachi Ltd. (Tokyo).

"Injection molding condition generation system and method" was invented by Daisuke Yagi (Tokyo), Ryotaro Shimada (Tokyo) and Kan Kobayashi (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "An injection molding condition generation system improves the quality of injection molding. The injection molding condition generation system acquires a material property value of a resin material and an injection molding condition using the first resin material based on a target value of a quality parameter related to a quality of a molded article, the first material property value, and a predeterm...