US Patent Issued to Hitachi High-Tech on July 14 for "Inspection system for detecting foreign material and scratch at edge of semiconductor wafer and non-transitory computer-readable medium storing a program for same" (Japanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,682,442, issued on July 14, was assigned to Hitachi High-Tech Corp. (Tokyo).

"Inspection system for detecting foreign material and scratch at edge of semiconductor wafer and non-transitory computer-readable medium storing a program for same" was invented by Takehiro Hirai (Tokyo), Yohei Minekawa (Tokyo) and Satoshi Takada (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure proposes a system for detecting a foreign material adhering to or a scratch formed on a bevel at an edge of a semiconductor wafer in order to detect the foreign material or defect on the bevel without using a reference image and including a learning device (90...