US Patent Issued to Hitachi High-Tech on Jan. 27 for "Semiconductor device manufacturing system and semiconductor device manufacturing method" (Japanese Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,537,175, issued on Jan. 27, was assigned to Hitachi High-Tech Corp. (Tokyo).

"Semiconductor device manufacturing system and semiconductor device manufacturing method" was invented by Toru Aramaki (Tokyo), Go Saito (Tokyo), Kenichiro Komeda (Tokyo), Yuji Enomoto (Tokyo) and Takashi Tsutsumi (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "The invention is to provide a semiconductor manufacturing apparatus system and a semiconductor device manufacturing method for reducing particles having an adverse effect in a manufacturing step of a semiconductor device. A semiconductor device manufacturing system, includes: a semiconductor manufacturing apparatus...