US Patent Issued to HITACHI ASTEMO on Sept. 23 for "Power module" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,424,508, issued on Sept. 23, was assigned to HITACHI ASTEMO LTD. (Hitachinaka, Japan).

"Power module" was invented by Hiromi Shimazu (Tokyo), Yujiro Kaneko (Hitachinaka, Japan) and Yusuke Takagi (Hitachinaka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A power module includes a first conductor plate to which a first power semiconductor element is bonded, a second conductor plate to which a second power semiconductor element is bonded, the second conductor plate being disposed adjacent to the first conductor plate, a first heat-dissipating member disposed counter to the first conductor plate and the second conductor plate, and a first insulatin...