ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,178, issued on Nov. 3, was assigned to HITACHI ASTEMO LTD. (Hitachinaka, Japan).

"Electronic device" was invented by Fumiya Iijima (Hitachinaka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A bendable circuit substrate (3) is provided with a first rigid part (11), a second rigid part (12) and a flexible part (13). The first rigid part (11) is provided with power source terminals (40) (positive electrode terminal (40A), negative electrode terminal (40B)), and power is supplied to the second rigid part (12) via power source positive electrode wirings (BA) of the flexible part (13). The power source positive electrode wirings (BA) are provided t...