ALEXANDRIA, Va., March 24 -- United States Patent no. 12,588,171, issued on March 24, was assigned to HITACHI ASTEMO LTD. (Hitachinaka, Japan).
"Heat exchange device and power conversion device" was invented by Yusuke Takagi (Hitachinaka, Japan) and Yujiro Kaneko (Hitachinaka, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A heat exchange device that is formed in a substantially rectangular shape and that cools a power semiconductor element, and a power conversion device comprising the heat exchange device, the heat exchange device including: a fin formation region in which cooling water flows in a transverse direction; and a buffer region formed in a lamination direction and facing the fin formation r...