US Patent Issued to HIRATA on Feb. 17 for "Solder supply unit, solder piece manufacturing device, part mounting device, and production system" (Japanese Inventors)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,551,959, issued on Feb. 17, was assigned to HIRATA Corp. (Kumamoto, Japan).

"Solder supply unit, solder piece manufacturing device, part mounting device, and production system" was invented by Toshiomi Ikeda (Kumamoto, Japan) and Tetsunori Matsuyoshi (Kumamoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A solder supply unit able to be attached to a solder cutting unit and is able to detached is provided. The solder supply unit includes a reel holder rotatably holding a reel of a tape-like solder material; and a guidance member guiding the tape-like solder material wound around the reel when the tape-like solder material is fed out. The guidanc...