ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,782,206, issued on Nov. 3, was assigned to HIMEC (Hanil Multidisciplinary Engineering Co.) (South Korea).
"System for diagnosing building envelope thermal performance based on field measurement information and method thereof" was invented by Tae Yun Aum (Seoul, South Korea), Jin Woong Son (Seoul, South Korea) and Jun Ho Hong (Seoul, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present inventive concept provides a system for diagnosing a building envelope thermal performance, comprising: a target zone input module for searching for a target zone including at least one outer wall in contact with the outdoor air from among spaces included ...