US Patent Issued to HighLevel on Nov. 11 for "Systems and methods for facilitating business prospecting in a tiered software framework" (American, Indian, Qatari Inventors)

ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,469,039, issued on Nov. 11, was assigned to HighLevel Inc..

"Systems and methods for facilitating business prospecting in a tiered software framework" was invented by Reshma Kris M. (Madurai, India), Pranoy Sarkar (Sonitpur, India), William Chase Buckner (Doylestown, Pa.), Aaditya Agarwal (Gurugram, India), Shaun Clark (Eugene, Ore.), Robin Alex (Dallas) and Varun Vairavan (Doha, Qatar).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments of a method for facilitating business prospecting in a tiered software framework include receiving third-party data associated with prospects in a geographic location; analyzing the third-party data of each prospe...