ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,560,984, issued on Feb. 24, was assigned to Hewlett Packard Enterprise Development LP (Spring, Texas).
"M.2 card adapter and heatsink" was invented by Shou-Jen Yang (New Taipei, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "An M.2 adapter/heatsink comprises a heat spreader clip configured to receive M.2 modules having multiple M.2 module lengths. The M.2 adapter/heatsink also comprises an adapter fastener and a spacer. The adapter fastener can be attached to the heat spreader clip at any one of a plurality of attachment locations corresponding respectively to the different M.2 module lengths. When an M.2 module is received in the clip, the adapt...