US Patent Issued to Hewlett Packard Enterprise Development on Feb. 10 for "Common fan plenum with separators between fans and impedance element at inlet to reduce recirculation upon fan failure" (Singaporean, American Inventors)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,288, issued on Feb. 10, was assigned to Hewlett Packard Enterprise Development LP (Spring, Texas).

"Common fan plenum with separators between fans and impedance element at inlet to reduce recirculation upon fan failure" was invented by See Yun Yow (Singapore), James D. Hensley (Rocklin, Calif.) and Mun Hoong Tai (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "An information processing device comprises heat generating components, a plenum, and fans arranged to flow air through the plenum and to cool the heat generating components. The device also comprises a recirculation inhibition mechanism to reduce the amount of air recirculation in the...